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General Description
Single and double-sided flexible circuits are extremely cost effective interconnection
media for low to high volume applications.
Benefits
- High reliability
- Space and mass saving
- Total repeatability
- 3-D packaging system
- Cost reduction
- Improved current carrying capability
- Improved heat dissipation
- Light weight
- Mechanical strength
- Excellent in dynamic applications
Materials/Applications
- Polyester - a low cost dielectric film. Lower temperature
performance capability, solderable with care. Automotive, communication,
consumer and similar highly cost conscious applications.
- Polyethylene naphthalate (PEN) - an intermediate
cost and performance option which can be soldered using conventional tin/lead
alloys. Automotive, communication, consumer, computer and other applications.
- Polyimide - high reliability, high performance
material with good thermal and mechanical properties. Numerous applications
from automotive to aerospace.
- EMI/RFI and cross-talk shielding can be achieved by the
use of silver loaded polymer inks.
- Surface finishes - tin/lead, nickel/gold, immersion
gold and OSP.
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