FLEX-RIGID MULTILAYER CIRCUITS
"A total interconnection and packaging solution"
General Description
This technology offers the designer the scope to achieve highly reliable,
compact interconnection and packaging configurations with a substantial reduction
in overall system cost.
Some of these benefits are associated with the elimination of often expensive connectors and a reduction in the overall time to assemble, test and install in the finished product.
Options
There are two widely used flex-rigid multilayer technologies which can broadly
be described as:
- Conventionally Structured Technology (adhesive and adhesiveless)
- Regal™ Flex technology Both of these constructions have their relative merits be it cost, capability or performance and we would advise that contact be made with our applications engineers in order to determine the most appropriate solution for your requirements.
The complexities associated with the relative features of these technologies cannot be adequately conveyed in this datasheet and reference to the appropriate sections of our comprehensive "Designers Guide" is advised. Broadly speaking, however, these technologies can be described as follows:
Conventionally Structured Technology A flex-rigid multilayer in which the inner "flex" layers comprise copper clad polyimide (adhesive or adhesiveless) and where these layers are continuous throughout the circuit structure, i.e. contained within the "multilayered" and the "flexing" portions.
Circuits structured in this way are generally suitable for low to medium layer count (4 to 10 layers) circuits where the thermal conditions likely to be experienced in service are not aggressive.
Regal™ Flex Circuits produced using this technology are structured in a manner which eliminates polyimide and acrylic adhesive from the multilayered areas. The advantages offered by this technology are related to complexity, high layer count and thermal performance.
The elimination of polyimide and acrylic materials greatly reduces the risk of "barrel cracking" which is a phenomenon resulting from z axis expansion.
Both these materials have high thermal co-efficients of expansion (TCEs) and are hydroscopic and therefore their elimination from the multilayered areas substantially enhances reliability.
Regal™ One and Regal™ Five There are two Regal™ constructions, Regal™ One and Regal™ Five, both of which offer very high layer count capability and reliability. The primary feature differentiating Regal™ One from Regal™ Five is associated with the bend radius through which "hinge" areas or "flying tails" are subjected during assembly into the equipment or in dynamic applications.
Benefits
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Conventional FRMLs
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Regal™ Flex
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Design
The complexity of these products and issues associated with their manufacture
are such that dialogue with our applications and/or product engineers during
the design phase is recommended. The cost of manufacture starts with design.
