SURFACE MOUNT INTERCONNECTS (SMIs)
Jumpers from Teknoflex

General Description
Surface mount interconnects (SMIs) developed by Teknoflex are the world's first fully machine placeable interconnection component.

These products which are supplied in standard 13 inch (330mm) diameter reels of 1500 circuits are available with 4 to 22 conductors on a 0.93mm pitch and with 10 to 40 conductors on a 0.50mm pitch.

Extensive development by Teknoflex has enabled the company to achieve a level of co-planarity which allows the SMI to be accurately placed by all industry standard "pick & place" machines.

The SMIs are assembled directly into solder paste in the same way and during the same process cycle as all other components are placed. The solder joints are made during the reflow process again utilizing industry standard equipment.

It is an ideal low cost product for board to board interconnection. The constructions and materials have been specifically selected to provide the most reliable and cost effective solution.

Applications
The SMI technology has been successfully employed in many applications including high volume automotive, medical, computer, power supplies, sensors and optical equipment.

Please contact our Customer Services Department for further information.

Benefits

  • Low cost component
  • Low cost assembly
  • Eliminates connectors
  • Supplied in tape and reel format (Waffle trays - special order)
  • Fully auto-placeable
  • Conventional solder reflow
  • Physically robust
  • Flexible
  • Light weight
  • Low profile
  • Good current carrying capability
  • Good in "bend to install" applications
  • Excellent vibration resistance in all axis

Specification

  • Conductor pitch - 0.50mm and 0.93mm
  • 0.50mm pitch - 10 to 40 conductors (as standard)
  • 0.93mm pitch - 4 to 22 conductors (as standard)
  • Standard size - Conductor Length: 15mm
    - Width: varies according to number of conductors
    - Maximum height: 1mm
  • Copper thickness (exposed finger area) 250 micron ± 10%
  • Copper thickness (bend area) 70 micron - 125 micron
  • Co-planarity of exposed fingers - 150 micron (total) 0.93mm pitch
    - 100 micron (total) 0.50mm pitch
  • Insulation thickness - 25 micron ± 10%
  • Dielectric material - polyimide (standard)
  • Temperature range - Assembly 150°C to 250°C typical SMT reflow
    - Operation -60°C to +125°C cyclic, +105°C continuous
  • Current rating (per conductor) - 0.50mm pitch 1.0A for 10°C rise above ambient
    - 0.93mm pitch 1.5A for 10°C rise above ambient
  • Flexural performace - 90° bend -> 100 cycles 1.6mm bend radius
    - 180° bend -> 50 cycles 1.6mm bend radius
  • Land finish - RoHS standard. Other finishes e.g. tin/lead available upon request
  • Custom designs available if required

Product Data

Flexible Printed Circuits
Sculptured Circuits
Sculptured Jumpers
Multilayer Flex
Flex-rigid Multilayer
Regal Flex
SMI Jumpers
Pin Flex
Reel to Reel
Component Assembly

Technical Articles

Markets

Designers Guide CD Rom

Quality Approvals

Contacts






Registered office:
Quarry Lane, Chichester,
West Sussex, PO19 8PE,
United Kingdom.

Registered in England and Wales No.
2620417

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